2025 Committee

Topic Co-Chairs:
Nobuhiko Nishiyama, Tokyo Institute of Technology, Japan
David Thomson, University of Southampton, UK

Committee Members:
Tomohiro Kita, Waseda University, Japan
Di Liang, Alibaba Group, USA
Stefan Lischke, IHP – Leibniz Institute for High Performance Microelectronics, Germany
Songtao Liu, Intel Corporation, USA
Patrick Lo, Advanced Micro Foundry Pte Ltd, Singapore
Takuya Okimoto, Sumitomo Electric Industries, Japan
Graham Reed, University of Southampton, UK
Chen Shang, UC Santa Barbara, USA
Junichi Suzuki, Mitsubishi Electric, Japan
Shin Tanaka, Fujitsu, Japan
Bassem, Tossoun, Hewlett Packard Labs, USA

Topic Co-Chairs:
Yung-Jr Hung, Sun Yat-sen University, Taiwan
Lars Zimmermann, IHP, Germany

Committee Members:
Eric Bernier, Huawei, Canada
Wim Bogaerts, Ghent University – IMEC, Belgium
Tommaso Cassese, Silicon Austria Labs (SAL), Austria
Woo-Young Choi, Yonsei University, Korea
Ming-Chang Lee, National Tsing Hua University, Taiwan
Xin Li, Rain Tree Photonics, Singapore
Wei Shi, Universite Laval, Quebec, Canada
Chao Xiang, University of Hong Kong, China

Topic Co-Chairs:
Guangwei Cong, AIST, Japan
Yunhong Ding, Denmark Technical University, Denmark

Committee Members:
Tao Chu, Zhejiang University, China
Martijn Heck, Eindhoven University of Technology (TU/e), The Netherlands
Shota Kita, NTT, Japan
Minhao Pu, DTU, Denmark
Brian Stern, Nokia Bell Labs, USA
Xian Xiao HPE USA
Linjie Zhou, SJTU, China

Topic Co-Chairs:
Jon Heffernan, University of Sheffield, UK
Dries Van Thourhout, University of Ghent, Belgium

Topic Co-Chairs:
Xinlun Cai, Sun Yat-sen University, China
Alan Wang, Baylor University, USA

Committee Members:
Zengguang Cheng, Fudan University, China
Liu Liu, Zhejiang University, China
Hidetaka Nishi, NTT, Japan
Carlos Rios Ocampo, University of Maryland, USA
Pablo Sanchis, Universitat Politècnica de València, Spain
Yonghui Tian, Lanzhou University, China
Ting Wang, Insititute of Physics, China
Mengyue Xu, University of Michigan, USA
Ying Xue, Hong Kong University of Science and Technology, Hongkong

Topic Co-Chairs:
Carlos Alonso-Ramos, Universite Paris-Saclay, France
Daoxin Dai, Zhejiang University, China

Committee Members:
Charles Baudot, Ciena, Canada
Frederic Boeuf, STMicroelectronics, France
Zhihong Huang, HPE Labs, USA
Ueli Koch, ETH Zurich, Switzerland
Yuriko Maegami, AIST, Japan
Paolo Pintus, University of Cagliari, Italy
Mitsuru Takenaka, University of Tokyo, Japan

Industry Chair:
Howard Rupprecht, CS Connected