Technical Program

This year’s International Conference on Group IV Photonics will cover four topics ranging from fundamental science to applied systems:

Novel Materials, Nanophotonics and Processes

This area focuses on materials, structures, phenomena and devices applicable to Group-IV platforms that are still in an investigative stage or that are not yet targeting specific application requirements. Novel materials and material combinations and structures that are enabling new functions or science, and nanophotonic structures are also included. Potential examples include (but are not limited to) low-dimensional structures, amorphous or disordered materials, graphene, complex oxides, GeSn, nanolasers, photonic crystals, antennas, gratings, subwavelength structures, and plasmonics and their hybrids.

Photonic Devices

This area focuses on Group IV photonic devices. Papers in this category concentrate on the device itself—its design, characteristics, and performance. Material systems include Si, SiN, SiON, and Ge photonic devices. Components include on-chip light sources, photodetectors, filters, sensors, gratings, modulators, optical couplers, switches, and phased arrays.


This area focuses on applications of Group IV photonic devices. Papers in this category focus on the use of integrated photonic elements in applications. Example applications are telecommunications, data communications, sensors, optical coherence tomography, deep learning, imaging, and LiDAR.

Electronic-Photonic Integrated Circuits & Systems

This area focuses on the design, technology (device and integration approaches), and applications of devices or assemblies that integrate optics and electronics, either hybrid or monolithic. Of particular interest are advanced node technologies and emerging applications that demonstrate new levels of performance offered by tight integration. Example technologies include monolithic integration (bulk and SOI CMOS), CMOS integration, 3D monolithic integration, hybrid integrated systems, interposers (photonics & electronic-photonic) and 2.5D and 3D multi-chip modules.